| 000 | 02991nam a22005295i 4500 | ||
|---|---|---|---|
| 001 | 978-981-16-1376-0 | ||
| 003 | DE-He213 | ||
| 005 | 20220801220407.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 210517s2021 si | s |||| 0|eng d | ||
| 020 |
_a9789811613760 _9978-981-16-1376-0 |
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| 024 | 7 |
_a10.1007/978-981-16-1376-0 _2doi |
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| 050 | 4 | _aTK7800-8360 | |
| 072 | 7 |
_aTJF _2bicssc |
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_aTEC008000 _2bisacsh |
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_aTJF _2thema |
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_a621.381 _223 |
| 100 | 1 |
_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _950068 |
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| 245 | 1 | 0 |
_aSemiconductor Advanced Packaging _h[electronic resource] / _cby John H. Lau. |
| 250 | _a1st ed. 2021. | ||
| 264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2021. |
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| 300 |
_aXXII, 498 p. 557 illus., 530 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aRecent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging. | |
| 520 | _aThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. | ||
| 650 | 0 |
_aElectronics. _93425 |
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| 650 | 0 |
_aSemiconductors. _93077 |
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| 650 | 0 |
_aIndustrial engineering. _931641 |
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| 650 | 0 |
_aProduction engineering. _93683 |
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| 650 | 1 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 650 | 2 | 4 |
_aSemiconductors. _93077 |
| 650 | 2 | 4 |
_aIndustrial and Production Engineering. _931644 |
| 710 | 2 |
_aSpringerLink (Online service) _950069 |
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| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811613753 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811613777 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811613784 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-981-16-1376-0 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
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_c78519 _d78519 |
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