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| 001 | 978-981-13-7224-7 | ||
| 003 | DE-He213 | ||
| 005 | 20220801213726.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 190403s2019 si | s |||| 0|eng d | ||
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_a9789811372247 _9978-981-13-7224-7 |
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_a10.1007/978-981-13-7224-7 _2doi |
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_a621.381 _223 |
| 100 | 1 |
_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _933934 |
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| 245 | 1 | 0 |
_aHeterogeneous Integrations _h[electronic resource] / _cby John H. Lau. |
| 250 | _a1st ed. 2019. | ||
| 264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2019. |
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| 300 |
_aXXII, 368 p. 386 illus., 342 illus. in color. _bonline resource. |
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_atext _btxt _2rdacontent |
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_acomputer _bc _2rdamedia |
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_aonline resource _bcr _2rdacarrier |
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_atext file _bPDF _2rda |
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| 505 | 0 | _aChapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations. | |
| 520 | _aHeterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc. | ||
| 650 | 0 |
_aElectronics. _93425 |
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| 650 | 0 |
_aElectronic circuits. _919581 |
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| 650 | 1 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 650 | 2 | 4 |
_aElectronic Circuits and Systems. _933935 |
| 710 | 2 |
_aSpringerLink (Online service) _933936 |
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| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811372230 |
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_iPrinted edition: _z9789811372254 |
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_iPrinted edition: _z9789811372261 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-981-13-7224-7 |
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