000 07138nam a2201609 i 4500
001 5769522
003 IEEE
005 20200421114119.0
006 m o d
007 cr |n|||||||||
008 151221s2006 njua ob 001 eng d
020 _a9780471754503
_qebook
020 _z0471754501
_qelectronic
020 _z0471466093
_qhardback
020 _z9780471466093
_qhardback
024 7 _a10.1109/9780471754503
_2doi
035 _a(CaBNVSL)mat05769522
035 _a(IDAMS)0b0000648154001a
040 _aCaBNVSL
_beng
_erda
_cCaBNVSL
_dCaBNVSL
050 4 _aTK7874
_b.A332 2006eb
245 0 0 _aAdvanced electronic packaging /
_cedited by Richard K. Ulrich, William D. Brown.
250 _a2nd ed
264 1 _aHoboken, New Jersey : $bWiley-Interscience,
_cc2006
264 2 _a[Piscataqay, New Jersey] :
_bIEEE Xplore,
_c[2006]
300 _a1 PDF (xxvi, 812 pages) :
_billustrations.
336 _atext
_2rdacontent
337 _aelectronic
_2isbdmedia
338 _aonline resource
_2rdacarrier
490 1 _aIEEE Press series on microelectronic systems ;
_v9
504 _aIncludes bibliographical references.
505 0 _aChapter 1: Introduction and overview of microelectronic packaging. -- Chapter 2: Materials for microelectronic packaging. -- Chapter 3: Processing technologies. -- Chapter 4: Organic printed circuit board materials and processes. -- Chapter 5: Ceramic substrates. -- Chapter 6: Electrical considerations, modeling, and simulation. -- Chapter 7: Thermal considerations. -- Chapter 8: Mechanical design considerations. -- Chapter 9: Discrete and embedded passive devices. -- Chapter 10: Electronic package assembly. -- Chapter 11: Design considerations. -- Chapter 12: Radio frequency and microwave packaging. -- Chapter 13: Power electronics packaging. -- Chapter 14: Multichip and three-dimensional packaging. -- Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study. -- Chapter 16: Reliability considerations. -- Chapter 17: Cost evaluation and analysis. -- Chapter 18: Analytical techniques for materials characterization.
506 1 _aRestricted to subscribers or individual electronic text purchasers.
520 _aAdvanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:. Packaging materials and applications. Modeling and simulations. Analytical techniques for materials. MEMS packaging. Fabrication technologies and package design. Reliability. Electrical, mechanical, and thermal considerations. Three-dimensional packagingAll the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.
530 _aAlso available in print.
538 _aMode of access: World Wide Web
588 _aDescription based on PDF viewed 12/21/2015.
650 0 _aMicroelectronic packaging.
655 0 _aElectronic books.
695 _aActuators
695 _aAerospace electronics
695 _aAircraft
695 _aAssembly
695 _aAtomic layer deposition
695 _aBandwidth
695 _aBiographies
695 _aBlades
695 _aBonding
695 _aCapacitors
695 _aCellular phones
695 _aCeramics
695 _aCompanies
695 _aComputers
695 _aConductivity
695 _aConductors
695 _aConsumer electronics
695 _aContamination
695 _aCooling
695 _aCopper
695 _aCosting
695 _aDelay
695 _aDielectric constant
695 _aDielectric losses
695 _aDielectrics
695 _aDriver circuits
695 _aEconomics
695 _aElectronic packaging thermal management
695 _aElectronics packaging
695 _aElectrostatic discharge
695 _aFabrication
695 _aFace
695 _aFailure analysis
695 _aFilms
695 _aForce
695 _aGold
695 _aHeat sinks
695 _aHeat transfer
695 _aHeating
695 _aImpedance
695 _aIndexes
695 _aInductors
695 _aIntegrated circuit interconnections
695 _aJunctions
695 _aLaminates
695 _aLattices
695 _aLogic gates
695 _aManufacturing
695 _aMaterials
695 _aMetallization
695 _aMetals
695 _aMicroassembly
695 _aMicroelectronics
695 _aMicromechanical devices
695 _aMicrowave circuits
695 _aMicrowave filters
695 _aMilitary aircraft
695 _aModems
695 _aMoisture
695 _aP-i-n diodes
695 _aPackaging
695 _aPlastics
695 _aPower distribution
695 _aPrinted circuits
695 _aProduction
695 _aReliability
695 _aResistance
695 _aResistors
695 _aScanning electron microscopy
695 _aSchottky diodes
695 _aSensitivity
695 _aSkin
695 _aSpectroscopy
695 _aStrain
695 _aStress
695 _aSubstrates
695 _aSurface treatment
695 _aSwitches
695 _aTemperature sensors
695 _aTerminology
695 _aThermal conductivity
695 _aThermal expansion
695 _aThermal resistance
695 _aThermal stability
695 _aThyristors
695 _aWires
695 _aWiring
695 _aX-ray diffraction
695 _aX-ray scattering
700 1 _aUlrich, Richard Kevin,
_d1955-
700 1 _aBrown, William D.,
_d1943-
710 2 _aIEEE Xplore (Online Service),
_edistributor.
710 2 _aJohn Wiley & Sons,
_epublisher.
730 0 _aIEEE Xplore (Livres)
776 0 8 _iPrint version:
_z9780471466093
830 0 _aIEEE Press series on microelectronic systems ;
_v9
856 4 2 _3Abstract with links to resource
_uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
942 _cEBK
999 _c59681
_d59681