000 | 04261nam a2201105 i 4500 | ||
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001 | 5426840 | ||
003 | IEEE | ||
005 | 20200421114118.0 | ||
006 | m o d | ||
007 | cr |n||||||||| | ||
008 | 151221s2010 njua ob 001 eng d | ||
010 | _z 2003041102 (print) | ||
020 |
_a9780471722939 _qelectronic |
||
020 | _a0471722936 | ||
020 |
_z9780471244318 _qprint |
||
024 | 7 |
_a10.1002/9780471722939 _2doi |
|
035 | _a(CaBNVSL)mat05426840 | ||
035 | _a(IDAMS)0b000064811f50b7 | ||
040 |
_aCaBNVSL _beng _erda _cCaBNVSL _dCaBNVSL |
||
050 | 4 |
_aTK7874 _b.I47145 2003eb |
|
082 | 0 | 4 |
_a621.3815 _222 |
245 | 0 | 0 |
_aIntegrated passive component technology / _cedited by Richard K. Ulrich, Leonard W. Schaper. |
264 | 1 |
_aPiscataway, New Jersey : _bIEEE Press, _cc2003. |
|
264 | 2 |
_a[Piscataqay, New Jersey] : _bIEEE Xplore, _c[2010] |
|
300 |
_a1 PDF (xix, 379 pages) : _billustrations. |
||
336 |
_atext _2rdacontent |
||
337 |
_aelectronic _2isbdmedia |
||
338 |
_aonline resource _2rdacarrier |
||
504 | _aIncludes bibliographical references and index. | ||
505 | 0 | _aCharacteristics and performance of planar resistors ; Integrated resistor materials and processes ; Dielectric materials for integrated capacitors ; Size and configuration of integrated capacitors ; Processing integrated capacitors ; Defects and yield issues / Richard K. Ulrich -- Electrical performance of integrated capacitors / Richard K. Ulrich, Leonard W. Schaper -- | |
506 | 1 | _aRestricted to subscribers or individual electronic text purchasers. | |
520 | _a. This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.. Describes the processes available for creating integrated passives, measuring their properties, and applying them.. Brings reader up to date in a fast-moving technology.. Enables reader to implement the technology into a manufacturing environment.. Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.. Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation. | ||
530 | _aAlso available in print. | ||
538 | _aMode of access: World Wide Web | ||
588 | _aDescription based on PDF viewed 12/21/2015. | ||
650 | 0 | _aPassive components. | |
650 | 0 |
_aIntegrated circuits _xDesign and construction. |
|
650 | 0 |
_aPrinted circuits _xDesign and construction. |
|
655 | 0 | _aElectronic books. | |
695 | _aAssembly | ||
695 | _aBiographies | ||
695 | _aBiological system modeling | ||
695 | _aBooks | ||
695 | _aCapacitance | ||
695 | _aCapacitors | ||
695 | _aCellular phones | ||
695 | _aCeramics | ||
695 | _aClocks | ||
695 | _aComputers | ||
695 | _aConductivity | ||
695 | _aConductors | ||
695 | _aCopper | ||
695 | _aCrystals | ||
695 | _aDensity measurement | ||
695 | _aDielectric constant | ||
695 | _aDielectric materials | ||
695 | _aEconomics | ||
695 | _aFabrication | ||
695 | _aFilms | ||
695 | _aFlexible printed circuits | ||
695 | _aImpedance | ||
695 | _aIndexes | ||
695 | _aInductance | ||
695 | _aInductors | ||
695 | _aIntegrated circuit modeling | ||
695 | _aIntegrated circuits | ||
695 | _aLayout | ||
695 | _aLead | ||
695 | _aMagnetic fields | ||
695 | _aMaterials | ||
695 | _aMathematical model | ||
695 | _aMetals | ||
695 | _aMicrostrip | ||
695 | _aMicrowave integrated circuits | ||
695 | _aPower distribution | ||
695 | _aPower supplies | ||
695 | _aResistance | ||
695 | _aResistors | ||
695 | _aRouting | ||
695 | _aSilicon | ||
695 | _aSpirals | ||
695 | _aSputtering | ||
695 | _aStrips | ||
695 | _aSubstrates | ||
695 | _aSurface treatment | ||
695 | _aTemperature distribution | ||
695 | _aThroughput | ||
700 | 1 | _aSchaper, Leonard W. | |
700 | 1 |
_aUlrich, Richard K. _q(Richard Kevin), _d1955- |
|
710 | 2 |
_aJohn Wiley & Sons, _epublisher. |
|
710 | 2 |
_aIEEE Xplore (Online service), _edistributor. |
|
776 | 0 | 8 |
_iPrint version: _z9780471244318 |
856 | 4 | 2 |
_3Abstract with links to resource _uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5426840 |
942 | _cEBK | ||
999 |
_c59631 _d59631 |