Includes bibliographical references and index.

Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.-Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Wide-Bandgap Semiconductor Device Technologies for High-Temperature and Harsh Environment Applications / Md Rafiqul Islam, Roisul H Galib, Montajar Sarkar, Shaestagir Chowdhury -- High-Temperature Lead-free Solder Materials and Applications / Mohd F M Sabri, Bakhtiar Ali, Suhana M Said -- Role of Alloying Addition in Zn-Based Pb-Free Solders / Khairul Islam, Ahmed Sharif -- Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy / Reza Mahmudi, Davood Farasheh, Seyyed S Biriaie -- Development of Zn-Al-x Ni Lead-Free Solders for High-Temperature Applications / Sanjoy Mallick, Md Sharear Kabir, Ahmed Sharif -- Study of Zn-Mg-Ag High-Temperature Solder Alloys / Roisul H Galib, Md Ashif Anwar, Ahmed Sharif -- Characterization of Zn-Mo and Zn-Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders / Khairul Islam, Ahmed Sharif -- Gold-Based Interconnect Systems for High-Temperature and Harsh Environments / Ayesha Akter, Ahmed Sharif, Rubayyat Mahbub -- Bi-Based Interconnect Systems and Applications / Manifa Noor, Ahmed Sharif -- Recent Advancement of Research in Silver-Based Solder Alloys / Ahmed Sharif -- Silver Nanoparticles as Interconnect Materials / Md Ashif Anwar, Roisul Hasan Galib, Ahmed Sharif -- Transient Liquid Phase Bonding / Tariq Islam, Ahmed Sharif -- All-Copper Interconnects for High-Temperature Applications / Ahmed Sharif -- Glass-Frit-Based Die-Attach Solution for Harsh Environments / Ahmed Sharif -- Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials / Md Muktadir Billah -- Reliability Study of Solder Joints in Electronic Packaging Technology / Ahmed Sharif, Sushmita Majumder.

Online resource; title from PDF title page (EBSCO, viewed March 28, 2019).