<![CDATA[Central Library Search for 'au:"Wong, C.P."']]>

<![CDATA[Central Library Search for 'au:"Wong, C.P."']]> https://opac.l2.nitk.ac.in/cgi-bin/koha/opac-search.pl?q=ccl=au%3A%22Wong%2C%20C.P.%22&format=rss2 2 0 50 Advanced Flip Chip Packaging ISBN 9781441957689 https://opac.l2.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=57339

. VII, 560 p. 413 illus., 242 illus. in color. 9781441957689

Place Hold on Advanced Flip Chip Packaging

]]> https://opac.l2.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=57339 Materials for Advanced Packaging ISBN 9783319450988 https://opac.l2.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=76285

. XVI, 969 p. 700 illus., 440 illus. in color. 9783319450988

Place Hold on Materials for Advanced Packaging

]]> https://opac.l2.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=76285