Electromigration in metals : (Record no. 82197)
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000 -LEADER | |
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fixed length control field | 02981nam a2200397 i 4500 |
001 - CONTROL NUMBER | |
control field | CR9781139505819 |
003 - CONTROL NUMBER IDENTIFIER | |
control field | UkCbUP |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20230516164908.0 |
006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
fixed length control field | m|||||o||d|||||||| |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
fixed length control field | cr|||||||||||| |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 120509s2022||||enk o ||1 0|eng|d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
International Standard Book Number | 9781139505819 (ebook) |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
Canceled/invalid ISBN | 9781107032385 (hardback) |
040 ## - CATALOGING SOURCE | |
Original cataloging agency | UkCbUP |
Language of cataloging | eng |
Description conventions | rda |
Transcribing agency | UkCbUP |
050 00 - LIBRARY OF CONGRESS CALL NUMBER | |
Classification number | TK7874.53 |
Item number | .H62 2022 |
082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.3815 |
Edition number | 23/eng/20220110 |
100 1# - MAIN ENTRY--PERSONAL NAME | |
Personal name | Ho, P. S., |
Relator term | author. |
9 (RLIN) | 67974 |
245 10 - TITLE STATEMENT | |
Title | Electromigration in metals : |
Remainder of title | fundamentals to nano-interconnects / |
Statement of responsibility, etc. | Paul S. Ho, Chao-Kun Hu, Martin Gall, Valeriy Sukharev. |
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
Place of production, publication, distribution, manufacture | Cambridge ; New York, NY : |
Name of producer, publisher, distributor, manufacturer | Cambridge University Pres, |
Date of production, publication, distribution, manufacture, or copyright notice | 2022. |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 1 online resource (xiii, 417 pages) : |
Other physical details | digital, PDF file(s). |
336 ## - CONTENT TYPE | |
Content type term | text |
Content type code | txt |
Source | rdacontent |
337 ## - MEDIA TYPE | |
Media type term | computer |
Media type code | c |
Source | rdamedia |
338 ## - CARRIER TYPE | |
Carrier type term | online resource |
Carrier type code | cr |
Source | rdacarrier |
500 ## - GENERAL NOTE | |
General note | Title from publisher's bibliographic system (viewed on 07 Apr 2022). |
505 0# - FORMATTED CONTENTS NOTE | |
Formatted contents note | Introduction to electromigration -- Fundamentals of electromigration -- Thermal stress characteristics and stress induced void formation in aluminium and copper interconnects -- Stress evolution and damage formation in confined metal lines under electric stressing -- Electromigration in Cu interconnect structures -- Scaling effects on microstructure and resistivity of Cu and Co nanointerconnects analysis of electromigration induced stress evolution and voiding in Cu damascene lines with microstructure -- Massive scale statistical studies for electromigration -- Assessment of electromigration damage in large on-chip power grids. |
520 ## - SUMMARY, ETC. | |
Summary, etc. | Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Interconnects (Integrated circuit technology) |
General subdivision | Materials. |
9 (RLIN) | 67975 |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Metals |
General subdivision | Electric properties. |
9 (RLIN) | 67976 |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Electrodiffusion. |
9 (RLIN) | 67977 |
700 1# - ADDED ENTRY--PERSONAL NAME | |
Personal name | Hu, Chao-Kun, |
Dates associated with a name | 1946- |
Relator term | author. |
9 (RLIN) | 67978 |
700 1# - ADDED ENTRY--PERSONAL NAME | |
Personal name | Gall, Martin, |
Relator term | author. |
9 (RLIN) | 67979 |
700 1# - ADDED ENTRY--PERSONAL NAME | |
Personal name | Sukharev, Valeriy, |
Dates associated with a name | 1952- |
Relator term | author. |
9 (RLIN) | 67980 |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
Relationship information | Print version: |
International Standard Book Number | 9781107032385 |
856 40 - ELECTRONIC LOCATION AND ACCESS | |
Uniform Resource Identifier | <a href="https://doi.org/10.1017/9781139505819">https://doi.org/10.1017/9781139505819</a> |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | eBooks |
No items available.