Advanced electronic packaging / (Record no. 59681)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 07138nam a2201609 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 5769522 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421114119.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 151221s2006 njua ob 001 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9780471754503 |
| -- | ebook |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | electronic |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | hardback |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | hardback |
| 245 00 - TITLE STATEMENT | |
| Title | Advanced electronic packaging / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 2nd ed |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 PDF (xxvi, 812 pages) : |
| 490 1# - SERIES STATEMENT | |
| Series statement | IEEE Press series on microelectronic systems ; |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Chapter 1: Introduction and overview of microelectronic packaging. -- Chapter 2: Materials for microelectronic packaging. -- Chapter 3: Processing technologies. -- Chapter 4: Organic printed circuit board materials and processes. -- Chapter 5: Ceramic substrates. -- Chapter 6: Electrical considerations, modeling, and simulation. -- Chapter 7: Thermal considerations. -- Chapter 8: Mechanical design considerations. -- Chapter 9: Discrete and embedded passive devices. -- Chapter 10: Electronic package assembly. -- Chapter 11: Design considerations. -- Chapter 12: Radio frequency and microwave packaging. -- Chapter 13: Power electronics packaging. -- Chapter 14: Multichip and three-dimensional packaging. -- Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study. -- Chapter 16: Reliability considerations. -- Chapter 17: Cost evaluation and analysis. -- Chapter 18: Analytical techniques for materials characterization. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:. Packaging materials and applications. Modeling and simulations. Analytical techniques for materials. MEMS packaging. Fabrication technologies and package design. Reliability. Electrical, mechanical, and thermal considerations. Three-dimensional packagingAll the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Ulrich, Richard Kevin, |
| 700 1# - AUTHOR 2 | |
| Author 2 | Brown, William D., |
| 856 42 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Hoboken, New Jersey : $bWiley-Interscience, |
| -- | c2006 |
| 264 #2 - | |
| -- | [Piscataqay, New Jersey] : |
| -- | IEEE Xplore, |
| -- | [2006] |
| 336 ## - | |
| -- | text |
| -- | rdacontent |
| 337 ## - | |
| -- | electronic |
| -- | isbdmedia |
| 338 ## - | |
| -- | online resource |
| -- | rdacarrier |
| 588 ## - | |
| -- | Description based on PDF viewed 12/21/2015. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronic packaging. |
| 695 ## - | |
| -- | Actuators |
| 695 ## - | |
| -- | Aerospace electronics |
| 695 ## - | |
| -- | Aircraft |
| 695 ## - | |
| -- | Assembly |
| 695 ## - | |
| -- | Atomic layer deposition |
| 695 ## - | |
| -- | Bandwidth |
| 695 ## - | |
| -- | Biographies |
| 695 ## - | |
| -- | Blades |
| 695 ## - | |
| -- | Bonding |
| 695 ## - | |
| -- | Capacitors |
| 695 ## - | |
| -- | Cellular phones |
| 695 ## - | |
| -- | Ceramics |
| 695 ## - | |
| -- | Companies |
| 695 ## - | |
| -- | Computers |
| 695 ## - | |
| -- | Conductivity |
| 695 ## - | |
| -- | Conductors |
| 695 ## - | |
| -- | Consumer electronics |
| 695 ## - | |
| -- | Contamination |
| 695 ## - | |
| -- | Cooling |
| 695 ## - | |
| -- | Copper |
| 695 ## - | |
| -- | Costing |
| 695 ## - | |
| -- | Delay |
| 695 ## - | |
| -- | Dielectric constant |
| 695 ## - | |
| -- | Dielectric losses |
| 695 ## - | |
| -- | Dielectrics |
| 695 ## - | |
| -- | Driver circuits |
| 695 ## - | |
| -- | Economics |
| 695 ## - | |
| -- | Electronic packaging thermal management |
| 695 ## - | |
| -- | Electronics packaging |
| 695 ## - | |
| -- | Electrostatic discharge |
| 695 ## - | |
| -- | Fabrication |
| 695 ## - | |
| -- | Face |
| 695 ## - | |
| -- | Failure analysis |
| 695 ## - | |
| -- | Films |
| 695 ## - | |
| -- | Force |
| 695 ## - | |
| -- | Gold |
| 695 ## - | |
| -- | Heat sinks |
| 695 ## - | |
| -- | Heat transfer |
| 695 ## - | |
| -- | Heating |
| 695 ## - | |
| -- | Impedance |
| 695 ## - | |
| -- | Indexes |
| 695 ## - | |
| -- | Inductors |
| 695 ## - | |
| -- | Integrated circuit interconnections |
| 695 ## - | |
| -- | Junctions |
| 695 ## - | |
| -- | Laminates |
| 695 ## - | |
| -- | Lattices |
| 695 ## - | |
| -- | Logic gates |
| 695 ## - | |
| -- | Manufacturing |
| 695 ## - | |
| -- | Materials |
| 695 ## - | |
| -- | Metallization |
| 695 ## - | |
| -- | Metals |
| 695 ## - | |
| -- | Microassembly |
| 695 ## - | |
| -- | Microelectronics |
| 695 ## - | |
| -- | Micromechanical devices |
| 695 ## - | |
| -- | Microwave circuits |
| 695 ## - | |
| -- | Microwave filters |
| 695 ## - | |
| -- | Military aircraft |
| 695 ## - | |
| -- | Modems |
| 695 ## - | |
| -- | Moisture |
| 695 ## - | |
| -- | P-i-n diodes |
| 695 ## - | |
| -- | Packaging |
| 695 ## - | |
| -- | Plastics |
| 695 ## - | |
| -- | Power distribution |
| 695 ## - | |
| -- | Printed circuits |
| 695 ## - | |
| -- | Production |
| 695 ## - | |
| -- | Reliability |
| 695 ## - | |
| -- | Resistance |
| 695 ## - | |
| -- | Resistors |
| 695 ## - | |
| -- | Scanning electron microscopy |
| 695 ## - | |
| -- | Schottky diodes |
| 695 ## - | |
| -- | Sensitivity |
| 695 ## - | |
| -- | Skin |
| 695 ## - | |
| -- | Spectroscopy |
| 695 ## - | |
| -- | Strain |
| 695 ## - | |
| -- | Stress |
| 695 ## - | |
| -- | Substrates |
| 695 ## - | |
| -- | Surface treatment |
| 695 ## - | |
| -- | Switches |
| 695 ## - | |
| -- | Temperature sensors |
| 695 ## - | |
| -- | Terminology |
| 695 ## - | |
| -- | Thermal conductivity |
| 695 ## - | |
| -- | Thermal expansion |
| 695 ## - | |
| -- | Thermal resistance |
| 695 ## - | |
| -- | Thermal stability |
| 695 ## - | |
| -- | Thyristors |
| 695 ## - | |
| -- | Wires |
| 695 ## - | |
| -- | Wiring |
| 695 ## - | |
| -- | X-ray diffraction |
| 695 ## - | |
| -- | X-ray scattering |
No items available.